| Electronics Packaging Technology Electronics_and_semiconductors > Semiconductors > Electronics Packaging Technology |  |
Provider of thermal solutions, leaded packages, ball grid array packages as well as assembly, test and analysis services.
Semiconductor and electronic packaging and handling products.
Manufacturer of thermoformed components and packaging for semiconductor devices, electronics, medical equipment, pharmaceuticals and food. Products are sold to the electronics, medical and food industries.
Manufacturer of semiconductor products that range from adhesives, soldering, surface mount, inspection and more.
Manufacturer of ceramic substrates as well as VIA/PAK(tm) and VBGA(tm) microwave packaging. VIA/PAK(tm) can accommodate a wide range of microwave integrated circuits (MICs) including GaAs and silicon monolithic MICs and alumina or aluminum-nitr.
Developer of intellectual property that enables high levels of electronic system integration through circuit packaging, device interconnection and assembly processes.
Manufacturer of hermetic packages for electronic components. Products are sold to multiple industries.
Provider of automated solutions for stand-alone work or fully integrated process lines.
Distributor of semiconductor die and provider of value-added die processing for multichip modules and other unencapsulated die applications and packaging capabilies.
Provider of dummy components and practice PC boards.
Manufacturer of materials for the semiconductor industry, including photolithography, packaging and flexible printed circuit materials.
Manufacturer of optical and laser-based non-contact profilometers for the measurement of 3D surface structures, including BGA, IC packages, flip chip, CSP and Thick Film.
Distributor of ceramic packaging for microelectronics assembly which includes PGAs, chip carriers, flat packs, sidebraze DIPs and more.
Manufacturer of electronic packaging and shielding for wire and cables including jackets and shields; and high temperature electrical insulation. Provider of custom fabrication services. Products and services are sold to the automotive, defens.
An integrated chip packaging company that also offers tape and reels, connector adapters and more.
Supplier of mold, die and automation systems for semiconductor assembly.
Provider of semiconductor foundry services, and fab with wafer, die and packaged unit capabilities, including GDSII.
Supplier of laminates, prepregs, resin-coated foils and dielectric solutions to the printed wiring board and electronics packaging industry.
Manufacturer of custom hybrid, chip on board (COB), surface mount (SMT) and through hole electronic circuits and modules.
Manufacturer of systems for semiconductor marking, package bar-coding, product date- stamping and garment-care labels.
A semiconductor assembly and test facility, including package, lead frame and printed circuit board laminate design services.
Provider of PC software solutions to the electronics packaging community.
Manufacturer of plastic semiconductor device packages and electronics adapters. Provider of manufacturing engineering services. Products and services are sold to the semiconductor and telecommunications industries. This company was capitalize.
Manufacturer of die attach systems for flip chip, chip scale packages, multi chip, hermetic packages and more.
Specialist in lead finish and soldering technology.
Provider of semiconductor substrates.
Technical review for test, assembly and packaging professionals.
Manufacturer of thin, lightweight and adhesiveless flex circuit substrates with circuit features for IC packaging, disk drives, medical devices and printers.
Seller of production equipment for lead inspection, lead conditioning, test handling, marking, tape-and-reel, burn-in and tooling.
Provider of materials used in the electronic assembly, semiconductor packaging and industrial joining processes.
Distributor of ceramic IC packaging materials. Inventory includes chip-scale, SOIC's, sidebraze, PGA's, LCC's, cerquad's, headers and lids.
Manufacturer of RF preheaters, encaspsulating mold presses, automatic die attach and ozone-cleaning systems.
Provider of microwave technique for processing/curing of advanced materials for the semiconductor and electronics packaging market.
Supplier of hermetic packages, electroplating technology, hermetic feedthroughs and glass-sealed metal packages and more for the high tech industry.
Provider of services to surface-mount technology (SMT) production equipment.
Manufacturer of printed circuit boards (PCBs) and cleaning equipment such as BGA in-line, seal circuits and PCB cleaning machines.
Supplier of solder paste, stencils, squeegee blades, stencil and PCB cleaners, cored wire solder, soldering fluxes, SMD adhesives, microelectronic packaging materials and spheres for BGA and chipscale applications.
Manufacturer of precision semiconductor equipment and tooling that includes lead conditioning systems and inspection and measurement systems.
Manufacturer of chip-on-board (COB), chip-on-flex (COF), chip-on-glass (COG), tape-automated bonding (TAB), flexible print circuit board (FPC) and touch screens.
Supplier of semiconductor equipment for testing devices and the packaging of any type of surface mount components.
Supplier of packaging and plating equipment to the semiconductor industry.
Manufacturer of substrates populated with chip-scale (CSP), ball grid (BGA) or ultrafine-pitch components and more.
Manufacturer of clean room compatible automation systems. Products are sold to the rigid disk manufacturing, biotechnology and medical industries.
Manufacturer of dispensing equipment, advanced circuitry material handling equipment, aqueous cleaners and testing systems.
Manufacturer of custom and standard packages for laser diodes, photo diodes, semiconductors, power hybrids and more.
Manufacturer of integrated circuit (IC) packages and carriers, piezoelectronics, fine ceramics plus ceramic cutting tools.
Supplier of semiconductor materials that include silicon wafers, ceramic packages and anti-static products.
Provider of wafer, BGA, lead frame and ceramic substrate handling systems, and an automated line of flux dispensing and coating systems.
Manufacturer of tooling and automated machinery for front-end to back-end processes.
Manufacturer of test and burn in sockets, receptacles, semiconductor packages and associated shipping aids.
Developer of packaging solutions for the semiconductor industry.
Provider of subcontracting bumping and packaging services for chip-size packages based on electroless metallization.
Manufacturer of wet cleaners and processors and hermetic package sealers for the integrated circuit and semiconductor industries.
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