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Specialist in surface mount technology (SMT), including fine pitch components, BGA components, and 0402 package-sized components.
Manufacturer of printed circuit board rework machines for SMT and BGA components and gold plating and multilayer desolder systems.
Supplier of ASICs (application-specific integrated circuits), hybrid circuits and multichip modules (MCMs) to the aerospace, telecom, industrial and related industries.
Manufacturer of die and wire bonders for discrete devices, integrated circuits (ICs), hybrid systems, multi-chip modules (MCM) and chip-on-board (COB) applications.
Manufacturer of advanced mixed-signal integrated circuits, including hall-effect sensors, motor driver ICs, and power interface and management ICs.
Manufacturer of chip-scale packages for use as mobile phones, DVC, PC cards and various other applications.
Manufacturer of hybrid circuit boards, ceramic multi-chip modules, thick-film substrates and cerlids. The cerlids are alumina ceramics used to seal semiconductor packages. Also a provider of surface mount design, testing and assembly services..
Manufacturer of IC test sockets, test adapters and receptacles. Products are sold to the semiconductor industry.
Manufacturer of integrated circuits (ICs) used in signal-processing applications which includes multichip module (MCM) packages.
Manufacturer of multichip modules (MCM), hybrids and surface-mount modules.
Manufacturer of microelectronics including hybrid circuits, multi-chip modules (MCMs), thin film components and flip chip assemblies.
Provider of semiconductor processing services that include flip chip wafer bumping for BGA and CSP applications, multiple redistribution technologies and repassivation.
Supplier of electronic wire and cable, GaAs wafers, hall sensors, leadframes, micro BGA, tape automated bonders, molded interconnect devices and more.
Provider of packaging portfolio and valuable services. Designs ball grid array (BGA) and leaded packages.
Manufacturer of flip chip on board (FCOB) modules. Manufactures DIMM memory modules.
European-based designer, manufacturer and marketer of microelectronic products, including SDRAM and SGRAM, memory modules, flash memory ICs and cards, networking devices, ASICs, multimedia ICs, hybrid/multi-chip modules, piezoelectric devices a.
Supplier of semiconductor assembly equipment that enables the assembly of advanced chip and wire, flip chip, chip scale packages and more.
Manufacturer of IC sockets, printed circuit cards, packaging products, intelligent connectors, BGA (ball grid array) and LGA (land grid array) sockets, adapters and a variety of jumper and cable assemblies.
Provider of polymer flip chip (PFC) manufacturing services and technology assistance, including solderless bump processes, polymer flip chips and isotropic conductive adhesives.
Provider of laminate substrate requirements, including packaging solutions that include the ultra ball grid array (BGA).
Interconnect solutions provider to original equipment manufacturers, including ball grid array (BGA) applications.
Distributor of semiconductor die and provider of value-added die processing for multichip modules and other unencapsulated die applications and packaging capabilies.
Manufacturer of ball grid array substrates.
Specialist in thick-film hybrid, multichip module-ceramic (MCM-C), microwave and surface mount technology (SMT) circuits.
Manufacturer of semiconductors. Produces multichip modules, hybrids, boards, smart cards, and complete builds.
Manufacturer of BGA adapters, QFP adapters and test leads. Provider of custom manufacturing. Products and services are sold to the embedded systems industry. This company was capitalized by private investment.
Supplier of materials such as indium phosphide (InP) and accessories to the electronics industry from ultrapure metals to chip-scale packaging.
Manufacturer of low-alpha and ultralow-alpha lead and lead products ideal for flip chip and C-4 technology in the semiconductor industry.
Supplier of interconnects and switches, including barrier strips, connectors and headers, data mates, dip switches, sockets and more.
Manufacturer of IC test and burn-in sockets, ball grid arrays (BGA) and more.
Provider of conducting and insulating materials, adhesives and flip chip bumping for the electronics industry.
Specialist in surface mount, chip-on-board, through-hole and final casing assemblies for the original equipment manufacturers' market.
Semiconductor manufacturer specializing in plastic, ceramic and TAB packaging. Has strategic alliances with subcontract assembly manufacturers throughout the US, Canada and Asia.
Provider of consultancy services for flip chip on glass (FCOG), flip chip on board (FCOB) and flip chip on flex (FCOF) packaging technologies.
Manufacturer of lead frames. Also designs, manufactures and supplies microelectronic packaging systems.
Manufacturer of special cases used to attach semiconductors to printed circuit boards. Company also provides IC assembly and test services. Products and services are sold to the semiconductor industry. This company was capitalized by private .
Manufacturer of integrated circuiits (ICs), silicon cores and multi-chip modules (MCMs).
Provider of wafer bumping services, reliability modeling, test vehicles, lead-free solder alloys, fluxes and assembly process implementation. Products and services are sold to the semiconductor industry.
Manufacturer of chip scale packaging and hybrid ICs. Products are sold to multiple industries. This company was capitalized by private investment and venture capital.
Manufacturer of ball grid array rework systems; automatic batch cleaning systems which are used for PCBs, screens and stencils; and surface mount repair/rework systems. Products are sold to the electronics and graphics industries. This company.
Manufacturer of ceramic products which includes packages, multichip modules and more for the semiconductor and related industries.
Manufacturer of BGA, micro SMD, laminate CSP and leadless lead-frame package (LLP) packages.
Manufacturer of chip-scale packages (CSPs) needed to address high-density requirements.
Supplier of electrical and electronic equipment, packaging, laser imaging systems, fiber-optic network cable systems and microflex circuits.
Package information.
Manufacturer of integrated circuit (IC) lead-frame applications equipment and material, chip on board (COB) and discrete device application equipment.
Manufacturer of hybrid/multichip modules (MCMs) and semiconductor equipment for first-level interconnect, automated ball bonders, wedge bonders and fully automated assembly lines.
Manufacturer of fully automated and manual flip chip bonding systems.
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