| Semiconductor Bonding Tools and Wire Electronics_and_semiconductors > Semiconductors > Semiconductor Bonding Tools and Wire |  |
Manufacturer of wire bonding equipment for the semiconductor and automotive industries. Products include wire bonders which ultrasonically bond aluminum wires ranging from 1 to 25 mil (33-100 microns) in diameter.
Manufacturer of RF preheaters, encaspsulating mold presses, automatic die attach and ozone-cleaning systems.
Manufacturer of manual, semi-auto and auto digital controlled bonders. Located in California.
Manufacturer of semiconductor processing equipment and agricultural manufacturing process controls. Products are sold to the semiconductor industry. This company was capitalized by private investment.
Specializing in semiconductor bonding tools. International customer service representation.
Manufacturer of hybrid/MCM and semiconductor equipment for first-level interconnect, automated ball bonders, wedge bonders, die bonders, and fully-automated assembly lines.
California-based manufacturer of die and wire bonders for the production of discrete devices, complex ICs, hybrid systems, multi-chip modules (MCM) and chip-on-board (COB) applications.
Supplier high performance RF and microwave semiconductor discrete devices and integrated circuits.
Provider of sevices and equipment dedicated to the die bonder industry.
Provider of products such as wafer saws, wire bonders, die attach and inspection equipment and more to the semiconductor and related industries.
Specialist in materials for semiconductor fabrication, including leadframes, packaging and assembly tooling.
Manufacturer of wire EDM and bond tooling. Products are sold to the semiconductor industry.
Manufacturer of high-precision bonding tools, semiconductor assembly products and designer of bonding processes for fine pitch applications.
Manufacturer of a multitude of wafer handling and inspection products, probe systems, flip chip bonders, substrate bonders, spin coaters and others.
Manufacturer of component placer and rework station, die bonders, semiautomatic die bonders and more.
Supplier of electronic wire and cable, GaAs wafers, hall sensors, leadframes, micro BGA, tape automated bonders, molded interconnect devices and more.
Supplier of mold, die and automation systems for semiconductor assembly.
Manufacturer of wire bonders, die bonders, die attach, epoxy die attach, pull tester, and shear tester for the semiconductor industry.
Manufacturer of ultrasonic wire bonding equipment. Products are sold to the semiconductor industry.
Custom manufacturer of ball grid array package assembly equipment for the semiconductor industry. This company was capitalized by private investment and venture capital.
Manufacturer of fully automated and manual flip chip bonding systems.
Manufacturer of liquid dispensing systems, robotic point-to-point iron soldering equipment and noncontact flame soldering equipment. Products are sold to the automation industry.
Manufacturer of wire bond and die bond testers, semiconductor die pick and place machines for use in the semiconductor industry.
Manufacturer of wire and ribbon bonding machines, ultrasonic peg bonders, die bonding equipment and dynamic force measuring equipment; and custom manufacturer of work stages. Products and services are sold to the microelectronics industry. Thi.
Manufacturer of die and wire bonders for flip chips packages and multichip module packages.
A distributor of electronic assembly and test equipment.
Supplier of semiconductor assembly equipment that enables the assembly of advanced chip and wire, flip chip, chip scale packages and more.
Provider of engineering services such as tool and die, machining, metal and thin-film stamping equipment.
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