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| AXIC Manufacturer of equipment used for the measurement of thin films for composition and thickness, etching, failure analysis, and many other semiconductor proecessing applications.
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TePla AG Specializing in drill hole cleaning, dry-etching and ashing of printed circuit boards and industrial plasma systems.
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Applied Materials Manufacturer of wafer fabrication systems that perform chemical vapor deposition (CVD), physical vapor deposition (PVD), epitaxial and polysilicon deposition, rapid thermal processing (RTP), plasma etching, ion implantation, metrology, inspectio.
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March Instruments, Inc. Manufacturer of plasma etching equipment. Products are sold to the electronics and semiconductor industries and laboratories. This company was capitalized by private investment.
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Surface Technology Systems (STS) Provider of etch and deposition processes and equipment to production and research-and-development customers in the MEMS, optoelectronic, compound semiconductor and thin-film head industries.
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Plasma Systems Provider of plasma etching, conformal coating, encapsulation and laboratory services for the printed circuit board assembly industry.
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Tru-Si Technologies Manufacturer of atmospheric downstream plasma (ADP) equipment for semiconductor wafer processing applications.
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Anatech Specialist in plasma technology based systems used to clean and modify surfaces, etch materials and deposit thin films.
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Samco Manufacturer of deposition, etching, and surface treatment systems for the semiconductor, disk drive and opto-electronics industries.
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Tokyo Electron (TEL) Manufacturer of semiconductor equipment, which includes, furnaces, CVD and PVD systems, coaters/developers, dry etchers, wafer probers, and wet cleaning systems.
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