| Semiconductor Surface Preparation Electronics_and_semiconductors > Semiconductors > Semiconductor Surface Preparation |  |
Specializes in electropolishing, precision mechanical polishing, passivation, oxygen cleaning, and chemical cleaning of stainless steel equipment.
Manufacturer of precision saws, standard and custom holding adapters, lapping machines and standard grinding and polishing equipment for fiber optics, materials research and other optic applications. Also a manufacturer of termination equipment.
Manufacturer of singulation, slicing and grinding systems and provider of manufacturing solutions for semiconductor and related industries.
Supplier of high-purity specialty metals, particularly germanium, as well as gallium, gallium arsenide, sapphire and silicon.
Provider of precision glass scribing and CO2 laser processing services. Services are provided to the aerospace, military and avion industries. This company was capitalized by private investment.
Manufacturer of lapping and polishing systems, metallographic products, abrasive media, consumables, and accessories.
Manufacturer of 6-8 inch oxidation diffusion wafers with specific oxide film thicknesses; provider of precision machining products and more.
Specialist in plasma technology-based systems used to clean and modify surfaces, etch materials and deposit thin films.
Supplier of diamond, cubic boron nitride (CBN), and polycrystalline products used for machining, cutting, grinding, polishing and drilling metal and metal alloys, composites, glass, plastics, wood and ceramics.
Manufacturer of polishing and grinding equipment for the semiconductor and precision optical industries.
Specialist in flat-processing technology and provider of high-productivity solutions.
Provider of MEMS (micro-electro-mechanical systems) solutions, including expertise in device design, bulk and surface micromachining, wafer bonding, thin-film deposition and stress control.
Stocking distributor of diamond saw blades, silicon wafer grinding wheels, wafer dicing blades, tab bonding tools and diamond wheels for semiconductor materials.
Manufacturer of dicing, scribing and grinding machines for the semiconductor and electronics industries.
Supplier of polishing compounds, and a provider of polishing pads used in the manufacture of advanced semiconductors (chips) and rigid disks.
Manufacturer of impregnated diamond cluster tools that have been designed to cope with a variety of common dressing operations.
Provider of information on materials-shaping and surface-finishing technology.
Manufacturer of deposition, etching and surface treatment systems for the semiconductor, disk drive and opto-electronics industries.
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