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| Bondline Electronic Adhesives |   | |
| Dexter - Polymer Systems Division |   | ||
| Dow Corning |   | ||
| Engineered Materials Systems, Inc. |   | ||
| Epoxy Technology |   | ||
| Ferro Corporation |   | ||
| Insulcast |   | ||
| Lord Corporation |   | ||
| Multicore Solders |   | ||
| Emerson & Cuming |   | ||
| OxyChem Electronic Materials |   | ||
| Polymark Resin Systems |   | ||
| Thermoset |   | ||
| Zymet, Inc. |   | ||
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