| Semiconductor Wafer Bumping - Engineering buyer's guide. |  |
| Nb of links = 7 | |
| |||
|
| Amkor Technology, Inc. | ||
| Hycomp, Inc. | |||
| EM Microelectronic-Marin SA | |||
| EM Microelectronic - USA / Division of Swatch group | |||
| PAC TECH GmbH | |||
| Polymer Flip Chip Corporation | |||
| Unitive Electronics Inc. | |||
| |||